STUDIES OF THE Ag-Pt INTERFACE FORMED BY Ag DEPOSITION FROM SULFOLANE SOLUTIONS ON THIN FILM ELECTRODES.

Rod K. Quinn, M. L. Knotek, Neal R Armstrong, N. E. Vanderborgh

Research output: Contribution to journalArticle

9 Citations (Scopus)

Abstract

Vapor deposition, thin film fabrication techniques have been applied to the preparation of Pt electrodes of various topographies. Large variations were observed in the electrical resistivities of these electrodes as a function of porosities. The effect of these film preparation techniques on Ag electrodeposition from solutions of AgClO//4 in sulfolane was examined. Roughness factors, obtained from differential capacitance measurements, varied from 1. 0 to 32. 8 over the range from bulk Pt to the most porous films. Analysis of cyclic voltammetric data and double potential step chronocoulometric results indicate silver deposition occurs without underpotential deposition in sulfolane in contrast to behavior found in aqueous medium.

Original languageEnglish (US)
Pages (from-to)1794-1799
Number of pages6
JournalJournal of the Electrochemical Society
Volume123
Issue number12
StatePublished - Dec 1976
Externally publishedYes

Fingerprint

Film preparation
Thin films
preparation
Electrodes
Vapor deposition
Capacitance measurement
electrodes
thin films
Silver
Electrodeposition
electrodeposition
Topography
topography
roughness
Porosity
Surface roughness
capacitance
silver
vapor deposition
porosity

ASJC Scopus subject areas

  • Electrochemistry
  • Surfaces, Coatings and Films
  • Surfaces and Interfaces

Cite this

STUDIES OF THE Ag-Pt INTERFACE FORMED BY Ag DEPOSITION FROM SULFOLANE SOLUTIONS ON THIN FILM ELECTRODES. / Quinn, Rod K.; Knotek, M. L.; Armstrong, Neal R; Vanderborgh, N. E.

In: Journal of the Electrochemical Society, Vol. 123, No. 12, 12.1976, p. 1794-1799.

Research output: Contribution to journalArticle

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