Subsurface damage characterization with nonlinear high numerical microscopy

Phat Lu, Youngsik Kim, Tom D. Milster

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Sub-surface damage characterization occurs in semiconductor device fabrication, like diamond turning and milling. Third harmonic generation (THG) microscopy can help to characterize subsurface damage, because nanometer sized asperities caused by defects amplify the THG signal.

Original languageEnglish (US)
Title of host publicationOptics InfoBase Conference Papers
PublisherOptical Society of America (OSA)
ISBN (Electronic)1557522863
DOIs
StatePublished - Oct 14 2014
EventLaser Science, LS 2014 - Tucson, United States
Duration: Oct 19 2014Oct 23 2014

Publication series

NameOptics InfoBase Conference Papers

Other

OtherLaser Science, LS 2014
CountryUnited States
CityTucson
Period10/19/1410/23/14

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

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