Supercritical CO2 low-k dielectric repair

Stéphane Malhouitre, Jan Van Hoeymissen, Anthony J Muscat, Pascal Granger, Paul Mertens

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

Restoration of NCS low-k dielectric in supercritical CO2 (scCO2) after etching and ashing plasma processing was studied using hexamethyldisilazane (HMDS) as silylating agent. Uniform restoration of the contact angle was demonstrated on 200 mm wafers. Shortening the time delay between etching/ashing and restoration improves the surface hydrophobicity. FTIR showed moisture removal and an increase of -CH3 groups. Ellipsometric porosimetry showed that the repaired film was partially sealed. TOFSIMS depth profiles of plasma damaged and repaired films indicate that the composition of both films was equivalent, suggesting that the scCO 2/HMDS restoration process was limited to the surface of plasma-damaged NCS. Surface restoration of the plasma damage film was confirmed by capacitance measured on Metal-Insulator-Metal (MIM) capacitors.

Original languageEnglish (US)
Title of host publicationECS Transactions
EditorsJ. Ruzyllo, T. Hattori, R.E. Novak
Pages301-308
Number of pages8
Volume1
Edition3
StatePublished - 2005
Event9th International Symposium on Cleaning Technology in Semiconductor Device Manufacturing - 2005 Fall Meeting of the Electrochemical Society - Los Angeles, CA, United States
Duration: Oct 16 2005Oct 21 2005

Other

Other9th International Symposium on Cleaning Technology in Semiconductor Device Manufacturing - 2005 Fall Meeting of the Electrochemical Society
CountryUnited States
CityLos Angeles, CA
Period10/16/0510/21/05

Fingerprint

Restoration
Repair
Plasmas
Etching
Plasma applications
Hydrophobicity
Metals
Contact angle
Time delay
Capacitors
Capacitance
Moisture
Low-k dielectric
Chemical analysis

ASJC Scopus subject areas

  • Engineering(all)

Cite this

Malhouitre, S., Van Hoeymissen, J., Muscat, A. J., Granger, P., & Mertens, P. (2005). Supercritical CO2 low-k dielectric repair. In J. Ruzyllo, T. Hattori, & R. E. Novak (Eds.), ECS Transactions (3 ed., Vol. 1, pp. 301-308)

Supercritical CO2 low-k dielectric repair. / Malhouitre, Stéphane; Van Hoeymissen, Jan; Muscat, Anthony J; Granger, Pascal; Mertens, Paul.

ECS Transactions. ed. / J. Ruzyllo; T. Hattori; R.E. Novak. Vol. 1 3. ed. 2005. p. 301-308.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Malhouitre, S, Van Hoeymissen, J, Muscat, AJ, Granger, P & Mertens, P 2005, Supercritical CO2 low-k dielectric repair. in J Ruzyllo, T Hattori & RE Novak (eds), ECS Transactions. 3 edn, vol. 1, pp. 301-308, 9th International Symposium on Cleaning Technology in Semiconductor Device Manufacturing - 2005 Fall Meeting of the Electrochemical Society, Los Angeles, CA, United States, 10/16/05.
Malhouitre S, Van Hoeymissen J, Muscat AJ, Granger P, Mertens P. Supercritical CO2 low-k dielectric repair. In Ruzyllo J, Hattori T, Novak RE, editors, ECS Transactions. 3 ed. Vol. 1. 2005. p. 301-308
Malhouitre, Stéphane ; Van Hoeymissen, Jan ; Muscat, Anthony J ; Granger, Pascal ; Mertens, Paul. / Supercritical CO2 low-k dielectric repair. ECS Transactions. editor / J. Ruzyllo ; T. Hattori ; R.E. Novak. Vol. 1 3. ed. 2005. pp. 301-308
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