System-level power and thermal modeling and analysis by orthogonal polynomial based response surface approach (OPRS)

Meiling Wang, Bharat Srinivas, Dongsheng Ma, Charlie Chung Ping Chen, Jun Li

Research output: Chapter in Book/Report/Conference proceedingConference contribution

8 Citations (Scopus)

Abstract

This paper proposes a new statistical response surface based power estimation technique. The new approach Is able to include a number of parameters such as multiple Vdd, multiple Vth and gate sizing parameters. It has both deterministic ability and statistical ability. The deterministic ability allows the new model to provide optimal design parameters for power reduction. The statistical ability can be used to model the process variation Impact on power.

Original languageEnglish (US)
Title of host publicationIEEE/ACM International Conference on Computer-Aided Design, Digest of Technical Papers, ICCAD
Pages727-734
Number of pages8
Volume2005
DOIs
StatePublished - 2005
Externally publishedYes
EventICCAD-2005: IEEE/ACM International Conference on Computer-Aided Design, 2005 - San Jose, CA, United States
Duration: Nov 6 2005Nov 10 2005

Other

OtherICCAD-2005: IEEE/ACM International Conference on Computer-Aided Design, 2005
CountryUnited States
CitySan Jose, CA
Period11/6/0511/10/05

Fingerprint

Polynomials
Hot Temperature
Optimal design

ASJC Scopus subject areas

  • Engineering(all)

Cite this

Wang, M., Srinivas, B., Ma, D., Chen, C. C. P., & Li, J. (2005). System-level power and thermal modeling and analysis by orthogonal polynomial based response surface approach (OPRS). In IEEE/ACM International Conference on Computer-Aided Design, Digest of Technical Papers, ICCAD (Vol. 2005, pp. 727-734). [1560161] https://doi.org/10.1109/ICCAD.2005.1560161

System-level power and thermal modeling and analysis by orthogonal polynomial based response surface approach (OPRS). / Wang, Meiling; Srinivas, Bharat; Ma, Dongsheng; Chen, Charlie Chung Ping; Li, Jun.

IEEE/ACM International Conference on Computer-Aided Design, Digest of Technical Papers, ICCAD. Vol. 2005 2005. p. 727-734 1560161.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Wang, M, Srinivas, B, Ma, D, Chen, CCP & Li, J 2005, System-level power and thermal modeling and analysis by orthogonal polynomial based response surface approach (OPRS). in IEEE/ACM International Conference on Computer-Aided Design, Digest of Technical Papers, ICCAD. vol. 2005, 1560161, pp. 727-734, ICCAD-2005: IEEE/ACM International Conference on Computer-Aided Design, 2005, San Jose, CA, United States, 11/6/05. https://doi.org/10.1109/ICCAD.2005.1560161
Wang M, Srinivas B, Ma D, Chen CCP, Li J. System-level power and thermal modeling and analysis by orthogonal polynomial based response surface approach (OPRS). In IEEE/ACM International Conference on Computer-Aided Design, Digest of Technical Papers, ICCAD. Vol. 2005. 2005. p. 727-734. 1560161 https://doi.org/10.1109/ICCAD.2005.1560161
Wang, Meiling ; Srinivas, Bharat ; Ma, Dongsheng ; Chen, Charlie Chung Ping ; Li, Jun. / System-level power and thermal modeling and analysis by orthogonal polynomial based response surface approach (OPRS). IEEE/ACM International Conference on Computer-Aided Design, Digest of Technical Papers, ICCAD. Vol. 2005 2005. pp. 727-734
@inproceedings{3e5d6d992bfa4f12b8a28afbfeeb08fe,
title = "System-level power and thermal modeling and analysis by orthogonal polynomial based response surface approach (OPRS)",
abstract = "This paper proposes a new statistical response surface based power estimation technique. The new approach Is able to include a number of parameters such as multiple Vdd, multiple Vth and gate sizing parameters. It has both deterministic ability and statistical ability. The deterministic ability allows the new model to provide optimal design parameters for power reduction. The statistical ability can be used to model the process variation Impact on power.",
author = "Meiling Wang and Bharat Srinivas and Dongsheng Ma and Chen, {Charlie Chung Ping} and Jun Li",
year = "2005",
doi = "10.1109/ICCAD.2005.1560161",
language = "English (US)",
isbn = "078039254X",
volume = "2005",
pages = "727--734",
booktitle = "IEEE/ACM International Conference on Computer-Aided Design, Digest of Technical Papers, ICCAD",

}

TY - GEN

T1 - System-level power and thermal modeling and analysis by orthogonal polynomial based response surface approach (OPRS)

AU - Wang, Meiling

AU - Srinivas, Bharat

AU - Ma, Dongsheng

AU - Chen, Charlie Chung Ping

AU - Li, Jun

PY - 2005

Y1 - 2005

N2 - This paper proposes a new statistical response surface based power estimation technique. The new approach Is able to include a number of parameters such as multiple Vdd, multiple Vth and gate sizing parameters. It has both deterministic ability and statistical ability. The deterministic ability allows the new model to provide optimal design parameters for power reduction. The statistical ability can be used to model the process variation Impact on power.

AB - This paper proposes a new statistical response surface based power estimation technique. The new approach Is able to include a number of parameters such as multiple Vdd, multiple Vth and gate sizing parameters. It has both deterministic ability and statistical ability. The deterministic ability allows the new model to provide optimal design parameters for power reduction. The statistical ability can be used to model the process variation Impact on power.

UR - http://www.scopus.com/inward/record.url?scp=33751416870&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=33751416870&partnerID=8YFLogxK

U2 - 10.1109/ICCAD.2005.1560161

DO - 10.1109/ICCAD.2005.1560161

M3 - Conference contribution

AN - SCOPUS:33751416870

SN - 078039254X

SN - 9780780392540

VL - 2005

SP - 727

EP - 734

BT - IEEE/ACM International Conference on Computer-Aided Design, Digest of Technical Papers, ICCAD

ER -