Technique for measuring slurry-flow dynamics during chemical-mechanical polishing

J. Coppeta, C. Rogers, Ara Philipossian, F. Kaufman

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)

Abstract

Chemical-Mechanical Polishing (CMP) is one of the fastest growing market segments in the semiconductor equipment industry. One of the critical consumable in CMP is a specialized solution, or slurry, which contains both free abrasives and chemicals acting together to planarize a wafer. These chemically active slurries account for approximately one fifth of the total cost of polishing a wafer. Because of the cost and potential toxicity, there are both financial and environmental pressures to reduce the amount of slurry consumed during the CMP process. To accomplish this in a systematic manner we have developed a technique for quantifying slurry flow patterns during CMP which involves using fluorescent dyes to measure slurry mixing, temperature gradients and slurry aging during the polishing. An aqueous fluorescent solution with matching viscosity is used to model the slurry, a glass window models the wafer and a commercially available polisher provides the polishing pad/table rotating work surface. This talk will focus on the diagnostic technique used to measure the slurry behavior as well as some semi-quantitative results on both the amount and uniformity of slurry entrained beneath the wafer as a function of pad topography, injection location and pad rotation rates.

Original languageEnglish (US)
Title of host publicationMaterials Research Society Symposium - Proceedings
EditorsW.J. Gray, I.R. Triay
PublisherMaterials Research Society
Pages95-100
Number of pages6
Volume447
StatePublished - 1997
Externally publishedYes
EventProceedings of the 1996 MRS Fall Meeting - Boston, MA, USA
Duration: Dec 2 1996Dec 6 1996

Other

OtherProceedings of the 1996 MRS Fall Meeting
CityBoston, MA, USA
Period12/2/9612/6/96

Fingerprint

Chemical mechanical polishing
Polishing
Slurries
Fluorescent Dyes
Abrasives
Flow patterns
Thermal gradients
Topography
Toxicity
Costs
Dyes
Aging of materials
Viscosity
Semiconductor materials
Glass
Industry

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials

Cite this

Coppeta, J., Rogers, C., Philipossian, A., & Kaufman, F. (1997). Technique for measuring slurry-flow dynamics during chemical-mechanical polishing. In W. J. Gray, & I. R. Triay (Eds.), Materials Research Society Symposium - Proceedings (Vol. 447, pp. 95-100). Materials Research Society.

Technique for measuring slurry-flow dynamics during chemical-mechanical polishing. / Coppeta, J.; Rogers, C.; Philipossian, Ara; Kaufman, F.

Materials Research Society Symposium - Proceedings. ed. / W.J. Gray; I.R. Triay. Vol. 447 Materials Research Society, 1997. p. 95-100.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Coppeta, J, Rogers, C, Philipossian, A & Kaufman, F 1997, Technique for measuring slurry-flow dynamics during chemical-mechanical polishing. in WJ Gray & IR Triay (eds), Materials Research Society Symposium - Proceedings. vol. 447, Materials Research Society, pp. 95-100, Proceedings of the 1996 MRS Fall Meeting, Boston, MA, USA, 12/2/96.
Coppeta J, Rogers C, Philipossian A, Kaufman F. Technique for measuring slurry-flow dynamics during chemical-mechanical polishing. In Gray WJ, Triay IR, editors, Materials Research Society Symposium - Proceedings. Vol. 447. Materials Research Society. 1997. p. 95-100
Coppeta, J. ; Rogers, C. ; Philipossian, Ara ; Kaufman, F. / Technique for measuring slurry-flow dynamics during chemical-mechanical polishing. Materials Research Society Symposium - Proceedings. editor / W.J. Gray ; I.R. Triay. Vol. 447 Materials Research Society, 1997. pp. 95-100
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