Test structures for analyzing the mechanisms of wafer chemical contaminant removal

J. Yan, H. J. Barnaby, B. Vermiere, T. Peterson, F. Shadman

Research output: Contribution to conferencePaper

Abstract

The design of an electrochemical sensor to measure wafer contaminant concentrations during ultrapure water rinses is discussed in the article. The techniques discussed in this paper also demonstrate the need to have additional monitor devices on-chip that enable the characterization of unwanted parasitic devices. The results obtained from the experiments conducted will provide, for the first time, data on the removal rates of contaminants from deep trenches, thereby enabling the identification of mechanisms and the development of models for wafer contaminant removal in advance semiconductor processes.

Original languageEnglish (US)
Pages209-213
Number of pages5
StatePublished - Jul 21 2003
EventIEEE International Conference on Microelectronic Test Structures - Monterey, CA, United States
Duration: Mar 17 2003Mar 20 2003

Other

OtherIEEE International Conference on Microelectronic Test Structures
CountryUnited States
CityMonterey, CA
Period3/17/033/20/03

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ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

Yan, J., Barnaby, H. J., Vermiere, B., Peterson, T., & Shadman, F. (2003). Test structures for analyzing the mechanisms of wafer chemical contaminant removal. 209-213. Paper presented at IEEE International Conference on Microelectronic Test Structures, Monterey, CA, United States.