Testing and modeling of solders using new test device, part 1: Models and testing

Chandrakant S. Desai, Zhichao Wang, Russell Whitenack, Tribikram Kundu

Research output: Contribution to journalArticle

5 Scopus citations

Abstract

The development and use of a new testing device called the thermomechanical-digital image correlation (TM-DIC), for testing and modeling of solders, was discussed. The TM-DIC device is capable of multidimensional (shear and normal) loading, temperature control (isothermal and thermomechanical), different rates of loading and creep at constant stress or displacement. The DIC provides advantages such as use of very small specimens and avoidance of grid attachment. The DIC is less robust than the foregoing methods and provides very good measurements to monitor strain, microcracking and fracture. The DIC software developed by K&T Measuring System, Germany has been integrated in TM-DIC.

Original languageEnglish (US)
Pages (from-to)225-231
Number of pages7
JournalJournal of Electronic Packaging, Transactions of the ASME
Volume126
Issue number2
DOIs
StatePublished - Jun 1 2004

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Mechanics of Materials
  • Computer Science Applications
  • Electrical and Electronic Engineering

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