Testing and modeling of solders using new test device, part 2: Calibration and validation

Chandrakant S. Dosai, Zhichao Wang, Russell Whitenack, Tribikram Kundu

Research output: Contribution to journalArticle

3 Scopus citations

Abstract

The determination of disturbed state concept (DSC) parameters by following different procedures was presented. It was found that some of the parameters were not significantly influenced by temperature and strain rates. The DSC model was used to predict typical stress-strain data and for a boundary value problem involving a thin small outline package (TSOP). The DCS model can provide a unified approach toward modeling the behavior including elastic, plastic and creep strains, and microcracking leading to fracture, softening and failure.

Original languageEnglish (US)
Pages (from-to)232-236
Number of pages5
JournalJournal of Electronic Packaging, Transactions of the ASME
Volume126
Issue number2
DOIs
StatePublished - Jun 1 2004

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Mechanics of Materials
  • Computer Science Applications
  • Electrical and Electronic Engineering

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