Testing and modeling of solders using new test device, part 2: Calibration and validation

Chandrakant S. Dosai, Zhichao Wang, Russell Whitenack, Tribikram Kundu

Research output: Contribution to journalArticle

3 Citations (Scopus)

Abstract

The determination of disturbed state concept (DSC) parameters by following different procedures was presented. It was found that some of the parameters were not significantly influenced by temperature and strain rates. The DSC model was used to predict typical stress-strain data and for a boundary value problem involving a thin small outline package (TSOP). The DCS model can provide a unified approach toward modeling the behavior including elastic, plastic and creep strains, and microcracking leading to fracture, softening and failure.

Original languageEnglish (US)
Pages (from-to)232-236
Number of pages5
JournalJournal of Electronic Packaging, Transactions of the ASME
Volume126
Issue number2
DOIs
StatePublished - Jun 2004

Fingerprint

Soldering alloys
Calibration
Microcracking
Testing
Boundary value problems
Strain rate
Creep
Plastics
Temperature

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Mechanical Engineering

Cite this

Testing and modeling of solders using new test device, part 2 : Calibration and validation. / Dosai, Chandrakant S.; Wang, Zhichao; Whitenack, Russell; Kundu, Tribikram.

In: Journal of Electronic Packaging, Transactions of the ASME, Vol. 126, No. 2, 06.2004, p. 232-236.

Research output: Contribution to journalArticle

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