The applications of EBG structures in power/ground plane pair SSN suppression

Guang Chen, Kathleen L Melde, John Prince

Research output: Chapter in Book/Report/Conference proceedingConference contribution

5 Citations (Scopus)

Abstract

SSN suppression in power delivery systems using electromagnetic band gap structures is discussed. Factors that affect the EBG performance are presented. The performance of a PDS with EBGs and decoupling capacitors is compared to designs with only decoupling capacitors.

Original languageEnglish (US)
Title of host publicationIEEE Topical Meeting on Electrical Performance of Electronic Packaging
Pages207-210
Number of pages4
StatePublished - 2004
EventIEEE 13th Topical Meeting on Electrical Performance of Electronic Packaging - Portland, OR, United States
Duration: Oct 25 2004Oct 27 2004

Other

OtherIEEE 13th Topical Meeting on Electrical Performance of Electronic Packaging
CountryUnited States
CityPortland, OR
Period10/25/0410/27/04

Fingerprint

Capacitors
Energy gap

ASJC Scopus subject areas

  • Engineering(all)

Cite this

Chen, G., Melde, K. L., & Prince, J. (2004). The applications of EBG structures in power/ground plane pair SSN suppression. In IEEE Topical Meeting on Electrical Performance of Electronic Packaging (pp. 207-210)

The applications of EBG structures in power/ground plane pair SSN suppression. / Chen, Guang; Melde, Kathleen L; Prince, John.

IEEE Topical Meeting on Electrical Performance of Electronic Packaging. 2004. p. 207-210.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Chen, G, Melde, KL & Prince, J 2004, The applications of EBG structures in power/ground plane pair SSN suppression. in IEEE Topical Meeting on Electrical Performance of Electronic Packaging. pp. 207-210, IEEE 13th Topical Meeting on Electrical Performance of Electronic Packaging, Portland, OR, United States, 10/25/04.
Chen G, Melde KL, Prince J. The applications of EBG structures in power/ground plane pair SSN suppression. In IEEE Topical Meeting on Electrical Performance of Electronic Packaging. 2004. p. 207-210
Chen, Guang ; Melde, Kathleen L ; Prince, John. / The applications of EBG structures in power/ground plane pair SSN suppression. IEEE Topical Meeting on Electrical Performance of Electronic Packaging. 2004. pp. 207-210
@inproceedings{1439c29cd52e4ed3b775ca56d6d9912c,
title = "The applications of EBG structures in power/ground plane pair SSN suppression",
abstract = "SSN suppression in power delivery systems using electromagnetic band gap structures is discussed. Factors that affect the EBG performance are presented. The performance of a PDS with EBGs and decoupling capacitors is compared to designs with only decoupling capacitors.",
author = "Guang Chen and Melde, {Kathleen L} and John Prince",
year = "2004",
language = "English (US)",
pages = "207--210",
booktitle = "IEEE Topical Meeting on Electrical Performance of Electronic Packaging",

}

TY - GEN

T1 - The applications of EBG structures in power/ground plane pair SSN suppression

AU - Chen, Guang

AU - Melde, Kathleen L

AU - Prince, John

PY - 2004

Y1 - 2004

N2 - SSN suppression in power delivery systems using electromagnetic band gap structures is discussed. Factors that affect the EBG performance are presented. The performance of a PDS with EBGs and decoupling capacitors is compared to designs with only decoupling capacitors.

AB - SSN suppression in power delivery systems using electromagnetic band gap structures is discussed. Factors that affect the EBG performance are presented. The performance of a PDS with EBGs and decoupling capacitors is compared to designs with only decoupling capacitors.

UR - http://www.scopus.com/inward/record.url?scp=15944428595&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=15944428595&partnerID=8YFLogxK

M3 - Conference contribution

AN - SCOPUS:15944428595

SP - 207

EP - 210

BT - IEEE Topical Meeting on Electrical Performance of Electronic Packaging

ER -