The design of broadband 60 GHz AMC antenna in multi-chip RF data transmission

Ho Hsin Yeh, Nobuki Hiramatsu, Kathleen L. Melde

Research output: Contribution to journalArticle

19 Scopus citations

Abstract

This paper presents the design of a 60 GHz antenna to be used in multi-core multi-chip (MCMC) computing systems. The antenna in package (AiP) solution has a ground-shielded metal and a periodically-patched artificial magnetic conductor (AMC) structure to widen the reflection coefficient bandwidth. The designed antenna with AMC layer broadcasts signals in the horizontal direction. Both simulated and measured results demonstrate that a-10dB reflection coefficient is achieved for a 10 GHz bandwidth and that radiation in the horizontal (chip-to-chip) direction is maintained.

Original languageEnglish (US)
Article number6376105
Pages (from-to)1623-1630
Number of pages8
JournalIEEE Transactions on Antennas and Propagation
Volume61
Issue number4
DOIs
StatePublished - Jan 1 2013

Keywords

  • 60 GHz antennas
  • Antenna-in-package
  • electronic packaging
  • printed antenna

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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