This paper presents the design of a 60 GHz antenna to be used in multi-core multi-chip (MCMC) computing systems. The antenna in package (AiP) solution has a ground-shielded metal and a periodically-patched artificial magnetic conductor (AMC) structure to widen the reflection coefficient bandwidth. The designed antenna with AMC layer broadcasts signals in the horizontal direction. Both simulated and measured results demonstrate that a-10dB reflection coefficient is achieved for a 10 GHz bandwidth and that radiation in the horizontal (chip-to-chip) direction is maintained.
- 60 GHz antennas
- electronic packaging
- printed antenna
ASJC Scopus subject areas
- Electrical and Electronic Engineering