Thermal conductivities of hypoeutectic Al-Cu alloys during solidification and cooling

D. R. Poirier, E. McBride

Research output: Contribution to journalArticle

18 Scopus citations


The thermal conductivity of hypoeutectic Al-Cu alloys during solidification and cooling was estimated by combining available data on electrical resistivity and thermal conductivity. To estimate the thermal conductivity of the solid alloys, the Smith-Palmer equation was used. This equation enables one to closely estimate the thermal conductivities from known data on electrical conductivities. The electrical resistivities of Al-Cu melts were also gathered. The Smith-Palmer equation was tested successfully for pure Al-melt and assumed to apply to Al-Cu melts, so that their thermal conductivities - could be estimated. Finally simple-mixture models were applied to estimate the electrical resistivities and thermal conductivities of the alloys during solidification.

Original languageEnglish (US)
Pages (from-to)48-52
Number of pages5
JournalMaterials Science and Engineering A
Issue number1-2
StatePublished - Mar 31 1997



  • Eutectic
  • Temperature coefficient
  • Thermal conductivity

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

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