Thermo-mechanical stresses for a triple junction of dissimilar materials: Global-local finite element analysis

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42 Scopus citations

Abstract

Finite element analysis with conventional elements fails to provide convergent stresses in regions where a free edge with a bimaterial interface or a junction of dissimilar materials exists. However, these regions are characteristic of electronic devices, and they are the most critical locations for failure. A finite element analysis with global (special) and local (conventional) elements has been developed to provide an accurate description of the stress field at these locations. The global elements capture the singular nature of the stresses arising from geometric and material discontinuities. With this method, the designer can accurately evaluate the thermo-mechanical integrity of various electronic devices.

Original languageEnglish (US)
Pages (from-to)103-117
Number of pages15
JournalTheoretical and Applied Fracture Mechanics
Volume30
Issue number2
DOIs
StatePublished - Oct 1998

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanical Engineering
  • Applied Mathematics

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