Thermo-mechanical stresses for a triple junction of dissimilar materials

Global-local finite element analysis

Research output: Contribution to journalArticle

41 Citations (Scopus)

Abstract

Finite element analysis with conventional elements fails to provide convergent stresses in regions where a free edge with a bimaterial interface or a junction of dissimilar materials exists. However, these regions are characteristic of electronic devices, and they are the most critical locations for failure. A finite element analysis with global (special) and local (conventional) elements has been developed to provide an accurate description of the stress field at these locations. The global elements capture the singular nature of the stresses arising from geometric and material discontinuities. With this method, the designer can accurately evaluate the thermo-mechanical integrity of various electronic devices.

Original languageEnglish (US)
Pages (from-to)103-117
Number of pages15
JournalTheoretical and Applied Fracture Mechanics
Volume30
Issue number2
DOIs
StatePublished - Oct 1998

Fingerprint

Dissimilar materials
Mechanical Stress
Electronics
Finite Element
Finite element method
Bimaterial
Stress Field
electronics
integrity
Integrity
stress distribution
Discontinuity
discontinuity
Evaluate

ASJC Scopus subject areas

  • Mechanical Engineering
  • Mechanics of Materials

Cite this

@article{5217ff266ee646d99a63a7607661a537,
title = "Thermo-mechanical stresses for a triple junction of dissimilar materials: Global-local finite element analysis",
abstract = "Finite element analysis with conventional elements fails to provide convergent stresses in regions where a free edge with a bimaterial interface or a junction of dissimilar materials exists. However, these regions are characteristic of electronic devices, and they are the most critical locations for failure. A finite element analysis with global (special) and local (conventional) elements has been developed to provide an accurate description of the stress field at these locations. The global elements capture the singular nature of the stresses arising from geometric and material discontinuities. With this method, the designer can accurately evaluate the thermo-mechanical integrity of various electronic devices.",
author = "Erdogan Madenci and Shkarayev, {Sergey V} and B. Sergeev",
year = "1998",
month = "10",
doi = "10.1016/S0167-8442(98)00047-0",
language = "English (US)",
volume = "30",
pages = "103--117",
journal = "Theoretical and Applied Fracture Mechanics",
issn = "0167-8442",
publisher = "Elsevier",
number = "2",

}

TY - JOUR

T1 - Thermo-mechanical stresses for a triple junction of dissimilar materials

T2 - Global-local finite element analysis

AU - Madenci, Erdogan

AU - Shkarayev, Sergey V

AU - Sergeev, B.

PY - 1998/10

Y1 - 1998/10

N2 - Finite element analysis with conventional elements fails to provide convergent stresses in regions where a free edge with a bimaterial interface or a junction of dissimilar materials exists. However, these regions are characteristic of electronic devices, and they are the most critical locations for failure. A finite element analysis with global (special) and local (conventional) elements has been developed to provide an accurate description of the stress field at these locations. The global elements capture the singular nature of the stresses arising from geometric and material discontinuities. With this method, the designer can accurately evaluate the thermo-mechanical integrity of various electronic devices.

AB - Finite element analysis with conventional elements fails to provide convergent stresses in regions where a free edge with a bimaterial interface or a junction of dissimilar materials exists. However, these regions are characteristic of electronic devices, and they are the most critical locations for failure. A finite element analysis with global (special) and local (conventional) elements has been developed to provide an accurate description of the stress field at these locations. The global elements capture the singular nature of the stresses arising from geometric and material discontinuities. With this method, the designer can accurately evaluate the thermo-mechanical integrity of various electronic devices.

UR - http://www.scopus.com/inward/record.url?scp=0032193111&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0032193111&partnerID=8YFLogxK

U2 - 10.1016/S0167-8442(98)00047-0

DO - 10.1016/S0167-8442(98)00047-0

M3 - Article

VL - 30

SP - 103

EP - 117

JO - Theoretical and Applied Fracture Mechanics

JF - Theoretical and Applied Fracture Mechanics

SN - 0167-8442

IS - 2

ER -