Thermomechanical stress analysis of laminates with a cutout via a complex potential-variational method

A. Barut, E. Madenci

Research output: Contribution to journalArticle

4 Scopus citations

Abstract

This study presents a new semianalytical method for the thermoelastic bending analysis of laminated plates with an elliptical hole under a nonuniform through-the-thickness temperature distribution. This new method employs the principle of stationary potential energy in conjunction with the complex variable approach for approximating displacement and stress resultants that automatically satisfy both in-plane and bending equilibrium equations. The numerical results demonstrate the influence of the material layup, uniform and nonuniform temperature distribution, and the cutout shape and its orientation on the thermal bending of flat laminates.

Original languageEnglish (US)
Pages (from-to)1-31
Number of pages31
JournalJournal of Thermal Stresses
Volume27
Issue number1
DOIs
StatePublished - Jan 2004

Keywords

  • Cutout
  • Laminated plate
  • Nonuniform temperature
  • Semianalytical
  • Thermal stress

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics

Fingerprint Dive into the research topics of 'Thermomechanical stress analysis of laminates with a cutout via a complex potential-variational method'. Together they form a unique fingerprint.

  • Cite this