The design and fabrication of a novel multi-degree-of-freedom force sensor is described. The three-dimensional structure of the sensor is a result of combining several microfabrication techniques: wet bulk micromachining, fusion bonding, chemical mechanical polishing, deep RIE, LPCVD, PECVD and thermally evaporated thin films. The sensor is designed to operate in the 0-500 μN force range and the 0-10 μNm torque range. The flexibility of the process to create overhanging structures with arbitrary lengths and heights is illustrated by the integration of micro-tweezers directly onto the force sensor. Among other advantages of the developed process is a dicing-free self-release of wafer structures. This allows very fragile structures, such as micromirrors and other optical components, to be individually packaged.
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Mechanics of Materials
- Mechanical Engineering
- Electrical and Electronic Engineering