Three-dimensional microfabrication for a multi-degree-of-freedom capacitive force sensor using fibre-chip coupling

E. T. Enikov, B. J. Nelson

Research output: Contribution to journalArticle

35 Scopus citations

Abstract

The design and fabrication of a novel multi-degree-of-freedom force sensor is described. The three-dimensional structure of the sensor is a result of combining several microfabrication techniques: wet bulk micromachining, fusion bonding, chemical mechanical polishing, deep RIE, LPCVD, PECVD and thermally evaporated thin films. The sensor is designed to operate in the 0-500 μN force range and the 0-10 μNm torque range. The flexibility of the process to create overhanging structures with arbitrary lengths and heights is illustrated by the integration of micro-tweezers directly onto the force sensor. Among other advantages of the developed process is a dicing-free self-release of wafer structures. This allows very fragile structures, such as micromirrors and other optical components, to be individually packaged.

Original languageEnglish (US)
Pages (from-to)492-497
Number of pages6
JournalJournal of Micromechanics and Microengineering
Volume10
Issue number4
DOIs
StatePublished - Dec 1 2000

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Mechanics of Materials
  • Mechanical Engineering
  • Electrical and Electronic Engineering

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