Transient thermal analysis of electronic packages by the boundary element method

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)

Abstract

The fabrication of electronic packages involves heating and then cooling from high processing temperatures. Because these devices consist of bonded materials with different thermal and mechanical properties, high thermo-mechanical stresses develop due to thermal and stiffness mismatches of bonded materials at regions with geometric and/or material discontinuities. These high stresses may result in crack initiations, leading to delaminations. Therefore, accurate temperature and flux distributions are critical when computing thermo-mechanical stresses, knowledge of which is essential for reliable designs. This study presents an analysis method based on the Boundary Element Method (BEM) to investigate the transient thermal response of electronic packages consisting of dissimilar materials while subjected to general boundary conditions. In order to demonstrate its capability, a chip on a substrate configuration subject to natural cooling is considered. The boundary conditions across the interfaces between the chip and the adhesive and adhesive and substrate are matched through exact expressions. The results capture the singular flux field arising from the mismatch in the thermal conduction coefficients and geometric discontinuity. The comparison of the results with those obtained from finite element analysis shows that BEM is rather robust and efficient for this class of transient conduction analyses.

Original languageEnglish (US)
Title of host publicationProceedings - Electronic Components and Technology Conference
Editors Anon
PublisherIEEE
Pages279-288
Number of pages10
StatePublished - 1997
EventProceedings of the 1997 47th IEEE Electronic Components & Technology Conference - San Jose, CA, USA
Duration: May 18 1997May 21 1997

Other

OtherProceedings of the 1997 47th IEEE Electronic Components & Technology Conference
CitySan Jose, CA, USA
Period5/18/975/21/97

Fingerprint

Boundary element method
Thermoanalysis
Adhesives
Boundary conditions
Fluxes
Cooling
Dissimilar materials
Substrates
Crack initiation
Delamination
Thermodynamic properties
Stiffness
Finite element method
Heating
Fabrication
Mechanical properties
Temperature
Processing
Hot Temperature

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

Guven, I., Chan, C., & Madenci, E. (1997). Transient thermal analysis of electronic packages by the boundary element method. In Anon (Ed.), Proceedings - Electronic Components and Technology Conference (pp. 279-288). IEEE.

Transient thermal analysis of electronic packages by the boundary element method. / Guven, I.; Chan, Cholik; Madenci, Erdogan.

Proceedings - Electronic Components and Technology Conference. ed. / Anon. IEEE, 1997. p. 279-288.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Guven, I, Chan, C & Madenci, E 1997, Transient thermal analysis of electronic packages by the boundary element method. in Anon (ed.), Proceedings - Electronic Components and Technology Conference. IEEE, pp. 279-288, Proceedings of the 1997 47th IEEE Electronic Components & Technology Conference, San Jose, CA, USA, 5/18/97.
Guven I, Chan C, Madenci E. Transient thermal analysis of electronic packages by the boundary element method. In Anon, editor, Proceedings - Electronic Components and Technology Conference. IEEE. 1997. p. 279-288
Guven, I. ; Chan, Cholik ; Madenci, Erdogan. / Transient thermal analysis of electronic packages by the boundary element method. Proceedings - Electronic Components and Technology Conference. editor / Anon. IEEE, 1997. pp. 279-288
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