Tribological characterization of post-CMP brush scrubbing

Ara Philipossian, Lateef Mustapha

Research output: Contribution to journalConference article

8 Scopus citations

Abstract

A novel PVA brush scrubber is constructed for studying the tribology of post-CMP cleaning processes using real-time coefficient of friction analysis. Results indicate that the tribological mechanism and the magnitude of the coefficient of friction strongly depend on a number of key factors such as tool kinematics, brush design, brush pressure and the pH of the cleaning fluid. Trends are qualitatively explained by considering brush deformation, liquid-wafer chemical interactions, tool kinematics, fluid dynamics, and frequency analysis of the friction signal.

Original languageEnglish (US)
Pages (from-to)275-280
Number of pages6
JournalSolid State Phenomena
Volume92
StatePublished - Jan 1 2003
EventThe International Symposium on Ultra Clean Processing of Silicon Surfaces V - Ostend, Belgium
Duration: Sep 16 2002Sep 18 2002

Keywords

  • Brush scrubbing
  • Coefficient of friction
  • PVA
  • Post-CMP cleaning
  • Tribology

ASJC Scopus subject areas

  • Atomic and Molecular Physics, and Optics
  • Materials Science(all)
  • Condensed Matter Physics

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