Tribological characterization of post-CMP brush scrubbing

Ara Philipossian, Lateef Mustapha

Research output: Contribution to journalArticle

8 Citations (Scopus)

Abstract

A novel PVA brush scrubber is constructed for studying the tribology of post-CMP cleaning processes using real-time coefficient of friction analysis. Results indicate that the tribological mechanism and the magnitude of the coefficient of friction strongly depend on a number of key factors such as tool kinematics, brush design, brush pressure and the pH of the cleaning fluid. Trends are qualitatively explained by considering brush deformation, liquid-wafer chemical interactions, tool kinematics, fluid dynamics, and frequency analysis of the friction signal.

Original languageEnglish (US)
Pages (from-to)275-280
Number of pages6
JournalSolid State Phenomena
Volume92
StatePublished - 2003

Fingerprint

Cytidine Monophosphate
washing
brushes
Brushes
Friction
coefficient of friction
cleaning
Cleaning
Kinematics
kinematics
scrubbers
tribology
Scrubbers
Tribology
fluid dynamics
Fluid dynamics
friction
wafers
trends
Fluids

Keywords

  • Brush scrubbing
  • Coefficient of friction
  • Post-CMP cleaning
  • PVA
  • Tribology

ASJC Scopus subject areas

  • Materials Science(all)
  • Physics and Astronomy (miscellaneous)
  • Condensed Matter Physics
  • Electronic, Optical and Magnetic Materials

Cite this

Tribological characterization of post-CMP brush scrubbing. / Philipossian, Ara; Mustapha, Lateef.

In: Solid State Phenomena, Vol. 92, 2003, p. 275-280.

Research output: Contribution to journalArticle

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