Tribological, thermal and kinetic attributes of 300 vs. 450 mm chemical mechanical planarization processes

Yubo Jiao, Xiaoyan Liao, Changhong Wu, Siannie Theng, Yun Zhuang, Yasa Sampurno, Michael Goldstein, Ara Philipossian

Research output: Contribution to journalArticle

9 Citations (Scopus)

Abstract

An existing 300 mm CMP tool has been modified to polish 450 mm wafers in order to demonstrate experimentally whether any differences exist in the tribological and thermal characteristics of the two processes, and from that, to infer whether one can expect any removal rate differences between the two systems. Results suggest that, within the ranges of parameter investigated, the two systems behave similarly in terms of their coefficients of friction and lubrication regimes. Additionally, it is shown that the 450 mm process, once adjusted for its platen velocity, runs only slightly warmer (by 1-3C) than its 300 mm counterpart. Experimental data, coupled with copper removal rate simulations show that the wafer surface reaction temperature of the 450 mm process is slightly higher (by 1-2C) than the 300 mm process. Consequently, simulated copper removal rates for the 450 mm process are slightly higher (2-13) than those of the 300 mm process at most polishing conditions. The above results indicate that when the current 300mm CMP process is scaled up to 450 mm, the tribological, thermal, and kinetic attributes of the process remain similar and do not undergo significant changes.

Original languageEnglish (US)
JournalJournal of the Electrochemical Society
Volume159
Issue number3
DOIs
StatePublished - 2012

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Chemical mechanical polishing
Cytidine Monophosphate
Kinetics
Copper
kinetics
wafers
platens
Industrial Oils
copper
Surface reactions
lubrication
Polishing
polishing
coefficient of friction
surface reactions
Lubrication
Friction
Hot Temperature
simulation
Temperature

ASJC Scopus subject areas

  • Electrochemistry
  • Electronic, Optical and Magnetic Materials
  • Materials Chemistry
  • Surfaces, Coatings and Films
  • Renewable Energy, Sustainability and the Environment
  • Condensed Matter Physics

Cite this

Tribological, thermal and kinetic attributes of 300 vs. 450 mm chemical mechanical planarization processes. / Jiao, Yubo; Liao, Xiaoyan; Wu, Changhong; Theng, Siannie; Zhuang, Yun; Sampurno, Yasa; Goldstein, Michael; Philipossian, Ara.

In: Journal of the Electrochemical Society, Vol. 159, No. 3, 2012.

Research output: Contribution to journalArticle

Jiao, Yubo ; Liao, Xiaoyan ; Wu, Changhong ; Theng, Siannie ; Zhuang, Yun ; Sampurno, Yasa ; Goldstein, Michael ; Philipossian, Ara. / Tribological, thermal and kinetic attributes of 300 vs. 450 mm chemical mechanical planarization processes. In: Journal of the Electrochemical Society. 2012 ; Vol. 159, No. 3.
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AU - Sampurno, Yasa

AU - Goldstein, Michael

AU - Philipossian, Ara

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