Tribological, thermal, and kinetic attributes of 300 vs. 450 mm chemical mechanical planarization processes

Yubo Jiao, Xiaoyan Liao, Changhong Wu, Yun Zhuang, Yasa Sampurno, Siannie Theng, Michael Godlstein, Ara Philipossian

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

An existing 300 mm CMP tool has been modified to polish 450 mm wafers in order to demonstrate experimentally whether any differences exist in the tribological and thermal characteristics of the two processes, and from that, to infer whether one can expect any removal rate differences between the two systems. Results suggest that, within the ranges of parameter investigated, the two systems behave similarly in terms of their coefficients of friction and lubrication regimes. Additionally, it is shown that the 450 mm process, once adjusted for its platen velocity, runs only slightly warmer (by 1 to 2 °C) than its 300 mm counterpart. Experimental data, coupled with copper removal rate simulations show that the wafer surface reaction temperatures of the 450 mm adjusted process are higher (by 2 to 3 °C) than the 300 mm process. Consequently, simulated copper removal rates for the 450 mm adjusted process are higher (by 8 to 31%) than those of the 300 mm process.

Original languageEnglish (US)
Title of host publicationICPT 2012 - International Conference on Planarization/CMP Technology, Proceedings
PublisherVDE Verlag GmbH
Pages357-362
Number of pages6
ISBN (Electronic)9783800734528
StatePublished - 2012
Event2012 International Conference on Planarization/CMP Technology, ICPT 2012 - Grenoble, France
Duration: Oct 15 2012Oct 17 2012

Publication series

NameICPT 2012 - International Conference on Planarization/CMP Technology, Proceedings

Conference

Conference2012 International Conference on Planarization/CMP Technology, ICPT 2012
Country/TerritoryFrance
CityGrenoble
Period10/15/1210/17/12

Keywords

  • 300 vs. 450 mm
  • Chemical Mechanical Polishing
  • Coefficient of Friction
  • Removal Rate
  • Wafer Surface Reaction Temperature

ASJC Scopus subject areas

  • Process Chemistry and Technology
  • Electronic, Optical and Magnetic Materials

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