Tribology and removal rate characteristics of chemical mechanical planarization pads containing water soluble particles

L. Charns, A. Philipossian

Research output: Contribution to journalArticle

1 Scopus citations

Abstract

Novel non-porous pads incorporating different amounts of embedded water soluble particles (WSP) have been characterized and compared to a conventional porous pad for interlayer dielectric (ILD) chemical mechanical planarization (CMP) applications. Removal rate results indicated that polishing with WSP pads was Prestonian in nature (similar to conventional porous pads). A decrease in removal rate at high combinations of pressure and velocity was observed during in-situ conditioning with WSP pads. This anomalous behavior was most likely due to the alternatively feeding and starving the wafer of slurry during in-situ conditioning since doubling the flow rate resolved the problem. The anomalous behavior, however, was not observed when conditioning was performed ex-situ. Fractional analysis indicated that polishing with WSP pads proceeded via boundary lubrication like the other porous pads with concentrically grooved surface geometries.

Original languageEnglish (US)
Pages (from-to)5696-5701
Number of pages6
JournalJapanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers
Volume45
Issue number7
DOIs
StatePublished - Jul 7 2006

Keywords

  • Chemical mechanical planarization (CMP)
  • Coefficient of friction (COF)
  • Pads
  • Removal rate
  • Tribology
  • Water soluble particle (WSP)

ASJC Scopus subject areas

  • Engineering(all)
  • Physics and Astronomy(all)

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