Unsteady wire sweep due to transfer molding in a 160l QFP package

H. Chai, Y. Zohar

Research output: Contribution to journalArticle

1 Scopus citations

Abstract

Wire sweep has been recognized as one of the major defects in encapsulation of electronic components by transfer molding. The phenomenon is very complicated as it is sensitive to a large number of parameters. In this experimental work, where a 160L QFP package used as the test vehicle, the detailed time-dependent wire displacement is measured for the following two different flow initial conditions: (i) the wire is immersed in the liquid and is displaced due to the acceleration of the flow from rest to the steady-state velocity, and (ii) the wire is surrounded by the ambient air and is displaced first due to the passage of the liquid front and then due to the hydrodynamic load. Significant differences have been observed between the two cases, with important implications for analytical and numerical studies, of wire sweep.

Original languageEnglish (US)
Pages (from-to)127-134
Number of pages8
JournalJournal of Electronic Packaging, Transactions of the ASME
Volume121
Issue number2
DOIs
StatePublished - Jun 1999
Externally publishedYes

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Mechanics of Materials
  • Computer Science Applications
  • Electrical and Electronic Engineering

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