Use of malonic acid in chemical-mechanical polishing (CMP) of tungsten

L. Zhang, S. Raghavan

Research output: Contribution to journalConference article

2 Scopus citations

Abstract

The use of malonic acid as an additive in alumina slurries used for the chemical mechanical polishing (CMP) of tungsten has been explored for the reduction of particulate contamination. The principal objective of this work was to delineate conditions under which alumina contamination on polished surfaces could be reduced. The interaction between malonic acid and alumina particles has been investigated through electrokinetic and adsorption measurements. At suitable malonic acid concentrations and pH values, tungsten and alumina surfaces develop a negative zeta potential resulting in conditions conductive to reduced particulate contamination. Small scale polishing experiments have been carried out to relate electrokinetic results to the level of particulate contamination after polishing.

Original languageEnglish (US)
Pages (from-to)115-123
Number of pages9
JournalMaterials Research Society Symposium - Proceedings
Volume477
StatePublished - Jan 1 1997
EventProceedings of the 1997 MRS Spring Meeting - San Francisco, CA, USA
Duration: Mar 31 1997Apr 3 1997

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

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