Use of malonic acid in chemical-mechanical polishing (CMP) of tungsten

L. Zhang, Srini Raghavan

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

The use of malonic acid as an additive in alumina slurries used for the chemical mechanical polishing (CMP) of tungsten has been explored for the reduction of particulate contamination. The principal objective of this work was to delineate conditions under which alumina contamination on polished surfaces could be reduced. The interaction between malonic acid and alumina particles has been investigated through electrokinetic and adsorption measurements. At suitable malonic acid concentrations and pH values, tungsten and alumina surfaces develop a negative zeta potential resulting in conditions conductive to reduced particulate contamination. Small scale polishing experiments have been carried out to relate electrokinetic results to the level of particulate contamination after polishing.

Original languageEnglish (US)
Title of host publicationMaterials Research Society Symposium - Proceedings
EditorsR.T. Fulks, G.N. Parsons, D.E. Slobadin, T.H. Yuzuriha
PublisherMRS
Pages115-123
Number of pages9
Volume477
StatePublished - 1997
EventProceedings of the 1997 MRS Spring Meeting - San Francisco, CA, USA
Duration: Mar 31 1997Apr 3 1997

Other

OtherProceedings of the 1997 MRS Spring Meeting
CitySan Francisco, CA, USA
Period3/31/974/3/97

Fingerprint

Tungsten
Chemical mechanical polishing
Aluminum Oxide
Contamination
Alumina
Acids
Polishing
Slurries
Zeta potential
Adsorption
malonic acid
Experiments

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials

Cite this

Zhang, L., & Raghavan, S. (1997). Use of malonic acid in chemical-mechanical polishing (CMP) of tungsten. In R. T. Fulks, G. N. Parsons, D. E. Slobadin, & T. H. Yuzuriha (Eds.), Materials Research Society Symposium - Proceedings (Vol. 477, pp. 115-123). MRS.

Use of malonic acid in chemical-mechanical polishing (CMP) of tungsten. / Zhang, L.; Raghavan, Srini.

Materials Research Society Symposium - Proceedings. ed. / R.T. Fulks; G.N. Parsons; D.E. Slobadin; T.H. Yuzuriha. Vol. 477 MRS, 1997. p. 115-123.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Zhang, L & Raghavan, S 1997, Use of malonic acid in chemical-mechanical polishing (CMP) of tungsten. in RT Fulks, GN Parsons, DE Slobadin & TH Yuzuriha (eds), Materials Research Society Symposium - Proceedings. vol. 477, MRS, pp. 115-123, Proceedings of the 1997 MRS Spring Meeting, San Francisco, CA, USA, 3/31/97.
Zhang L, Raghavan S. Use of malonic acid in chemical-mechanical polishing (CMP) of tungsten. In Fulks RT, Parsons GN, Slobadin DE, Yuzuriha TH, editors, Materials Research Society Symposium - Proceedings. Vol. 477. MRS. 1997. p. 115-123
Zhang, L. ; Raghavan, Srini. / Use of malonic acid in chemical-mechanical polishing (CMP) of tungsten. Materials Research Society Symposium - Proceedings. editor / R.T. Fulks ; G.N. Parsons ; D.E. Slobadin ; T.H. Yuzuriha. Vol. 477 MRS, 1997. pp. 115-123
@inproceedings{ba49567f9ed041ef9c88a0e624be751a,
title = "Use of malonic acid in chemical-mechanical polishing (CMP) of tungsten",
abstract = "The use of malonic acid as an additive in alumina slurries used for the chemical mechanical polishing (CMP) of tungsten has been explored for the reduction of particulate contamination. The principal objective of this work was to delineate conditions under which alumina contamination on polished surfaces could be reduced. The interaction between malonic acid and alumina particles has been investigated through electrokinetic and adsorption measurements. At suitable malonic acid concentrations and pH values, tungsten and alumina surfaces develop a negative zeta potential resulting in conditions conductive to reduced particulate contamination. Small scale polishing experiments have been carried out to relate electrokinetic results to the level of particulate contamination after polishing.",
author = "L. Zhang and Srini Raghavan",
year = "1997",
language = "English (US)",
volume = "477",
pages = "115--123",
editor = "R.T. Fulks and G.N. Parsons and D.E. Slobadin and T.H. Yuzuriha",
booktitle = "Materials Research Society Symposium - Proceedings",
publisher = "MRS",

}

TY - GEN

T1 - Use of malonic acid in chemical-mechanical polishing (CMP) of tungsten

AU - Zhang, L.

AU - Raghavan, Srini

PY - 1997

Y1 - 1997

N2 - The use of malonic acid as an additive in alumina slurries used for the chemical mechanical polishing (CMP) of tungsten has been explored for the reduction of particulate contamination. The principal objective of this work was to delineate conditions under which alumina contamination on polished surfaces could be reduced. The interaction between malonic acid and alumina particles has been investigated through electrokinetic and adsorption measurements. At suitable malonic acid concentrations and pH values, tungsten and alumina surfaces develop a negative zeta potential resulting in conditions conductive to reduced particulate contamination. Small scale polishing experiments have been carried out to relate electrokinetic results to the level of particulate contamination after polishing.

AB - The use of malonic acid as an additive in alumina slurries used for the chemical mechanical polishing (CMP) of tungsten has been explored for the reduction of particulate contamination. The principal objective of this work was to delineate conditions under which alumina contamination on polished surfaces could be reduced. The interaction between malonic acid and alumina particles has been investigated through electrokinetic and adsorption measurements. At suitable malonic acid concentrations and pH values, tungsten and alumina surfaces develop a negative zeta potential resulting in conditions conductive to reduced particulate contamination. Small scale polishing experiments have been carried out to relate electrokinetic results to the level of particulate contamination after polishing.

UR - http://www.scopus.com/inward/record.url?scp=0030655243&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0030655243&partnerID=8YFLogxK

M3 - Conference contribution

AN - SCOPUS:0030655243

VL - 477

SP - 115

EP - 123

BT - Materials Research Society Symposium - Proceedings

A2 - Fulks, R.T.

A2 - Parsons, G.N.

A2 - Slobadin, D.E.

A2 - Yuzuriha, T.H.

PB - MRS

ER -