Use of urea-choline chloride eutectic solvent for back end of line cleaning applications

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12 Citations (Scopus)

Abstract

A liquid mixture formed from two benign chemicals, urea and choline chloride, in the molar ratio of 2:1 has been evaluated for post etch residue (PER) removal from copper surface. Residue films were prepared by etching DUV photoresist films coated on copper in CF4/O2 plasma. Film removal was evaluated under immersion cleaning conditions using X-ray photoelectron spectroscopy and scanning electron microscopy and verified using electrochemical impedance spectroscopy measurements. The residue film was effectively removed in the temperature range of 40-70C. The results of this study show that choline chloride and urea based DES system has the potential to function as a back end of line cleaning formulation.

Original languageEnglish (US)
JournalElectrochemical and Solid-State Letters
Volume14
Issue number9
DOIs
StatePublished - 2011

Fingerprint

choline
Choline
ureas
Urea
eutectics
Eutectics
cleaning
Cleaning
chlorides
Copper
copper
Photoresists
Electrochemical impedance spectroscopy
photoresists
submerging
Etching
X ray photoelectron spectroscopy
etching
photoelectron spectroscopy
impedance

ASJC Scopus subject areas

  • Electrochemistry
  • Electrical and Electronic Engineering
  • Materials Science(all)
  • Chemical Engineering(all)
  • Physical and Theoretical Chemistry

Cite this

@article{c5a9232083d2475aabfeb75c236636b4,
title = "Use of urea-choline chloride eutectic solvent for back end of line cleaning applications",
abstract = "A liquid mixture formed from two benign chemicals, urea and choline chloride, in the molar ratio of 2:1 has been evaluated for post etch residue (PER) removal from copper surface. Residue films were prepared by etching DUV photoresist films coated on copper in CF4/O2 plasma. Film removal was evaluated under immersion cleaning conditions using X-ray photoelectron spectroscopy and scanning electron microscopy and verified using electrochemical impedance spectroscopy measurements. The residue film was effectively removed in the temperature range of 40-70C. The results of this study show that choline chloride and urea based DES system has the potential to function as a back end of line cleaning formulation.",
author = "Thanu, {D. P R} and Srini Raghavan and Keswani, {Manish K}",
year = "2011",
doi = "10.1149/1.3597656",
language = "English (US)",
volume = "14",
journal = "Electrochemical and Solid-State Letters",
issn = "1099-0062",
publisher = "Electrochemical Society, Inc.",
number = "9",

}

TY - JOUR

T1 - Use of urea-choline chloride eutectic solvent for back end of line cleaning applications

AU - Thanu, D. P R

AU - Raghavan, Srini

AU - Keswani, Manish K

PY - 2011

Y1 - 2011

N2 - A liquid mixture formed from two benign chemicals, urea and choline chloride, in the molar ratio of 2:1 has been evaluated for post etch residue (PER) removal from copper surface. Residue films were prepared by etching DUV photoresist films coated on copper in CF4/O2 plasma. Film removal was evaluated under immersion cleaning conditions using X-ray photoelectron spectroscopy and scanning electron microscopy and verified using electrochemical impedance spectroscopy measurements. The residue film was effectively removed in the temperature range of 40-70C. The results of this study show that choline chloride and urea based DES system has the potential to function as a back end of line cleaning formulation.

AB - A liquid mixture formed from two benign chemicals, urea and choline chloride, in the molar ratio of 2:1 has been evaluated for post etch residue (PER) removal from copper surface. Residue films were prepared by etching DUV photoresist films coated on copper in CF4/O2 plasma. Film removal was evaluated under immersion cleaning conditions using X-ray photoelectron spectroscopy and scanning electron microscopy and verified using electrochemical impedance spectroscopy measurements. The residue film was effectively removed in the temperature range of 40-70C. The results of this study show that choline chloride and urea based DES system has the potential to function as a back end of line cleaning formulation.

UR - http://www.scopus.com/inward/record.url?scp=79960233073&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=79960233073&partnerID=8YFLogxK

U2 - 10.1149/1.3597656

DO - 10.1149/1.3597656

M3 - Article

AN - SCOPUS:79960233073

VL - 14

JO - Electrochemical and Solid-State Letters

JF - Electrochemical and Solid-State Letters

SN - 1099-0062

IS - 9

ER -