VLSI interconnect design automation using quantitative and symbolic techniques

Tajana Simunic, Jerzy W Rozenblit, John R. Brews

Research output: Contribution to journalArticle

1 Citation (Scopus)

Abstract

This paper presents a framework for design automation of VLSI interconnect geometries. Crosstalk, overshoot, undershoot, signal delay, and line impedance are design performance parameters under consideration. Since the dependence of electrical performance parameters on geometry is not easily defined, both qualitative and quantitative techniques are used. Two knowledge bases are introduced - a model and simulation base. The model base contains models used for terminations, transmission line parameter extractors, and transmission lines. The simulation knowledge base contains a set of approximations and routines for the exact evaluation of electrical performance parameters. Procedures are introduced for the automatic extraction of applicable models and simulation techniques in the design process. An unconstrained optimization routine is used as a design search technique. The approach presented here gives faster results than approaches shown in literature, with little sacrifice of accuracy.

Original languageEnglish (US)
Pages (from-to)803-812
Number of pages10
JournalIEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging
Volume19
Issue number4
DOIs
StatePublished - Nov 1996

Fingerprint

Automation
Electric lines
Geometry
Crosstalk

Keywords

  • Crosstalk
  • Interconnect design automation
  • Model-based and simulation techniques
  • Signal delay optimization

ASJC Scopus subject areas

  • Engineering(all)

Cite this

@article{c7370eb9fc0349b9b2019c6dcc55483e,
title = "VLSI interconnect design automation using quantitative and symbolic techniques",
abstract = "This paper presents a framework for design automation of VLSI interconnect geometries. Crosstalk, overshoot, undershoot, signal delay, and line impedance are design performance parameters under consideration. Since the dependence of electrical performance parameters on geometry is not easily defined, both qualitative and quantitative techniques are used. Two knowledge bases are introduced - a model and simulation base. The model base contains models used for terminations, transmission line parameter extractors, and transmission lines. The simulation knowledge base contains a set of approximations and routines for the exact evaluation of electrical performance parameters. Procedures are introduced for the automatic extraction of applicable models and simulation techniques in the design process. An unconstrained optimization routine is used as a design search technique. The approach presented here gives faster results than approaches shown in literature, with little sacrifice of accuracy.",
keywords = "Crosstalk, Interconnect design automation, Model-based and simulation techniques, Signal delay optimization",
author = "Tajana Simunic and Rozenblit, {Jerzy W} and Brews, {John R.}",
year = "1996",
month = "11",
doi = "10.1109/96.544372",
language = "English (US)",
volume = "19",
pages = "803--812",
journal = "IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging",
issn = "1070-9894",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
number = "4",

}

TY - JOUR

T1 - VLSI interconnect design automation using quantitative and symbolic techniques

AU - Simunic, Tajana

AU - Rozenblit, Jerzy W

AU - Brews, John R.

PY - 1996/11

Y1 - 1996/11

N2 - This paper presents a framework for design automation of VLSI interconnect geometries. Crosstalk, overshoot, undershoot, signal delay, and line impedance are design performance parameters under consideration. Since the dependence of electrical performance parameters on geometry is not easily defined, both qualitative and quantitative techniques are used. Two knowledge bases are introduced - a model and simulation base. The model base contains models used for terminations, transmission line parameter extractors, and transmission lines. The simulation knowledge base contains a set of approximations and routines for the exact evaluation of electrical performance parameters. Procedures are introduced for the automatic extraction of applicable models and simulation techniques in the design process. An unconstrained optimization routine is used as a design search technique. The approach presented here gives faster results than approaches shown in literature, with little sacrifice of accuracy.

AB - This paper presents a framework for design automation of VLSI interconnect geometries. Crosstalk, overshoot, undershoot, signal delay, and line impedance are design performance parameters under consideration. Since the dependence of electrical performance parameters on geometry is not easily defined, both qualitative and quantitative techniques are used. Two knowledge bases are introduced - a model and simulation base. The model base contains models used for terminations, transmission line parameter extractors, and transmission lines. The simulation knowledge base contains a set of approximations and routines for the exact evaluation of electrical performance parameters. Procedures are introduced for the automatic extraction of applicable models and simulation techniques in the design process. An unconstrained optimization routine is used as a design search technique. The approach presented here gives faster results than approaches shown in literature, with little sacrifice of accuracy.

KW - Crosstalk

KW - Interconnect design automation

KW - Model-based and simulation techniques

KW - Signal delay optimization

UR - http://www.scopus.com/inward/record.url?scp=0030287402&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0030287402&partnerID=8YFLogxK

U2 - 10.1109/96.544372

DO - 10.1109/96.544372

M3 - Article

AN - SCOPUS:0030287402

VL - 19

SP - 803

EP - 812

JO - IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging

JF - IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging

SN - 1070-9894

IS - 4

ER -