Wettability and cleaning of silicon wafers in tetramethyl ammonium hydroxide-based solutions

J. S. Jeon, S. Raghavan

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Scopus citations

Abstract

The effectiveness of commercially available tetramethyl ammonium hydroxide (TMAH)-based solutions (PFC-1 and ANC-1) in modulating the wettability of silicon was investigated. The results showed that hydrophobic silicon wafers can be made wettable by immersion/emersion cycling in TMAH solutions or through the addition of hydrogen peroxide or surfactant to the solutions. The etch rate of silicon wafer in the various TMAH-containing solutions was also investigated. Particle removal, investigated as a function of solution pH and initial particle count on wafers, showed that there is an optimum particle count on the wafers above which particle removal with PFC-1 solution is feasible.

Original languageEnglish (US)
Title of host publicationProceedings, Annual Technical Meeting - Institute of Environmental Sciences
Editors Anon
PublisherPubl by Inst of Environmental Sciences
Pages268-273
Number of pages6
ISBN (Print)1877862193
StatePublished - Dec 1 1993
EventProceedings of the 39th Annual Technical Meeting of Institute of Environmental Sciences - Las Vegas, NV, USA
Duration: May 2 1993May 7 1993

Publication series

NameProceedings, Annual Technical Meeting - Institute of Environmental Sciences
Volume1
ISSN (Print)0073-9227

Other

OtherProceedings of the 39th Annual Technical Meeting of Institute of Environmental Sciences
CityLas Vegas, NV, USA
Period5/2/935/7/93

ASJC Scopus subject areas

  • Environmental Engineering

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    Jeon, J. S., & Raghavan, S. (1993). Wettability and cleaning of silicon wafers in tetramethyl ammonium hydroxide-based solutions. In Anon (Ed.), Proceedings, Annual Technical Meeting - Institute of Environmental Sciences (pp. 268-273). (Proceedings, Annual Technical Meeting - Institute of Environmental Sciences; Vol. 1). Publ by Inst of Environmental Sciences.