The effectiveness of commercially available tetramethyl ammonium hydroxide (TMAH)-based solutions (PFC-1 and ANC-1) in modulating the wettability of silicon was investigated. The results showed that hydrophobic silicon wafers can be made wettable by immersion/emersion cycling in TMAH solutions or through the addition of hydrogen peroxide or surfactant to the solutions. The etch rate of silicon wafer in the various TMAH-containing solutions was also investigated. Particle removal, investigated as a function of solution pH and initial particle count on wafers, showed that there is an optimum particle count on the wafers above which particle removal with PFC-1 solution is feasible.
ASJC Scopus subject areas
- Environmental Engineering