Wire sweep has been recognized as a critical process defect which can result in device failure. The phenomenon is very complicated as it is sensitive to a large number of parameters. In this experimental work, the influence of some of the more important factors is investigated. These parameters include fluid-flow speed, wire-bond density, mold cavity height, and mold vent size. A 160L QFP package bonded with gold wires in a transparent mold is used as the test vehicle.
|Original language||English (US)|
|Number of pages||6|
|Journal||Journal of Electronic Packaging, Transactions of the ASME|
|Publication status||Published - Sep 1999|
ASJC Scopus subject areas
- Electrical and Electronic Engineering
- Mechanical Engineering