Wire Sweep Due to Transfer Molding in a 160L QFP Package under Steady-State Conditions

H. Chai, Yitshak Zohar

Research output: Contribution to journalArticle

4 Scopus citations

Abstract

Wire sweep has been recognized as a critical process defect which can result in device failure. The phenomenon is very complicated as it is sensitive to a large number of parameters. In this experimental work, the influence of some of the more important factors is investigated. These parameters include fluid-flow speed, wire-bond density, mold cavity height, and mold vent size. A 160L QFP package bonded with gold wires in a transparent mold is used as the test vehicle.

Original languageEnglish (US)
Pages (from-to)137-142
Number of pages6
JournalJournal of Electronic Packaging, Transactions of the ASME
Volume121
Issue number3
Publication statusPublished - Sep 1999
Externally publishedYes

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ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Mechanical Engineering

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