Wire sweep due to transfer molding in a 160l qfp package under steady-state conditions

H. Chai, Y. Zohar

Research output: Contribution to journalArticlepeer-review

4 Scopus citations

Fingerprint Dive into the research topics of 'Wire sweep due to transfer molding in a 160l qfp package under steady-state conditions'. Together they form a unique fingerprint.

Engineering & Materials Science

Chemical Compounds