Yield function for solder elastoviscoplastic modeling

Research output: Contribution to journalArticle

4 Citations (Scopus)

Abstract

Field reliability extrapolations from accelerated tests necessitate simulation of a variety of material behaviors under general loading conditions. The Hierarchical Incremental Single Surface (HiSS) yield function (Desai, C. S., 200I, Mechanics of Materials and Interfaces: The Disturbed State Concept, CRC Press, Boca Raton, FL.) has been applied extensively to a wide range of materials, from solders and silicon to ceramics and geotechnical materials, for simulating continuous-yield elastoplastic and elastoviscoplastic behavior. This work presents a continuous-yield function that avoids problems with HiSS for thermal and tensile loading. Validations are presented for eutectic Pb/Sn data of Wang et al. (Wang, Z., Desai, C.S., and Kundu, T., 2001, "Disturbed State Constitutive Modeling and Testing of Joining Materials in Electronic Packaging," report to NSF for Materials Processing and Manufacturing Division Grant 9812686, University of Arizona, Tucson, AZ). Limitations on the range of validity of the elastoplastic and the Perzyna elastoviscoplastic formulations are discussed.

Original languageEnglish (US)
Pages (from-to)147-156
Number of pages10
JournalJournal of Electronic Packaging, Transactions of the ASME
Volume127
Issue number2
DOIs
StatePublished - Jun 2005

Fingerprint

Soldering alloys
Electronics packaging
Silicon
Extrapolation
Joining
Eutectics
Mechanics
Testing
Processing

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Mechanical Engineering

Cite this

Yield function for solder elastoviscoplastic modeling. / Dube, M.; Kundu, Tribikram.

In: Journal of Electronic Packaging, Transactions of the ASME, Vol. 127, No. 2, 06.2005, p. 147-156.

Research output: Contribution to journalArticle

@article{318f63a049d94d5c8e0d3416128f97a6,
title = "Yield function for solder elastoviscoplastic modeling",
abstract = "Field reliability extrapolations from accelerated tests necessitate simulation of a variety of material behaviors under general loading conditions. The Hierarchical Incremental Single Surface (HiSS) yield function (Desai, C. S., 200I, Mechanics of Materials and Interfaces: The Disturbed State Concept, CRC Press, Boca Raton, FL.) has been applied extensively to a wide range of materials, from solders and silicon to ceramics and geotechnical materials, for simulating continuous-yield elastoplastic and elastoviscoplastic behavior. This work presents a continuous-yield function that avoids problems with HiSS for thermal and tensile loading. Validations are presented for eutectic Pb/Sn data of Wang et al. (Wang, Z., Desai, C.S., and Kundu, T., 2001, {"}Disturbed State Constitutive Modeling and Testing of Joining Materials in Electronic Packaging,{"} report to NSF for Materials Processing and Manufacturing Division Grant 9812686, University of Arizona, Tucson, AZ). Limitations on the range of validity of the elastoplastic and the Perzyna elastoviscoplastic formulations are discussed.",
author = "M. Dube and Tribikram Kundu",
year = "2005",
month = "6",
doi = "10.1115/1.1869514",
language = "English (US)",
volume = "127",
pages = "147--156",
journal = "Journal of Electronic Packaging, Transactions of the ASME",
issn = "1043-7398",
publisher = "American Society of Mechanical Engineers(ASME)",
number = "2",

}

TY - JOUR

T1 - Yield function for solder elastoviscoplastic modeling

AU - Dube, M.

AU - Kundu, Tribikram

PY - 2005/6

Y1 - 2005/6

N2 - Field reliability extrapolations from accelerated tests necessitate simulation of a variety of material behaviors under general loading conditions. The Hierarchical Incremental Single Surface (HiSS) yield function (Desai, C. S., 200I, Mechanics of Materials and Interfaces: The Disturbed State Concept, CRC Press, Boca Raton, FL.) has been applied extensively to a wide range of materials, from solders and silicon to ceramics and geotechnical materials, for simulating continuous-yield elastoplastic and elastoviscoplastic behavior. This work presents a continuous-yield function that avoids problems with HiSS for thermal and tensile loading. Validations are presented for eutectic Pb/Sn data of Wang et al. (Wang, Z., Desai, C.S., and Kundu, T., 2001, "Disturbed State Constitutive Modeling and Testing of Joining Materials in Electronic Packaging," report to NSF for Materials Processing and Manufacturing Division Grant 9812686, University of Arizona, Tucson, AZ). Limitations on the range of validity of the elastoplastic and the Perzyna elastoviscoplastic formulations are discussed.

AB - Field reliability extrapolations from accelerated tests necessitate simulation of a variety of material behaviors under general loading conditions. The Hierarchical Incremental Single Surface (HiSS) yield function (Desai, C. S., 200I, Mechanics of Materials and Interfaces: The Disturbed State Concept, CRC Press, Boca Raton, FL.) has been applied extensively to a wide range of materials, from solders and silicon to ceramics and geotechnical materials, for simulating continuous-yield elastoplastic and elastoviscoplastic behavior. This work presents a continuous-yield function that avoids problems with HiSS for thermal and tensile loading. Validations are presented for eutectic Pb/Sn data of Wang et al. (Wang, Z., Desai, C.S., and Kundu, T., 2001, "Disturbed State Constitutive Modeling and Testing of Joining Materials in Electronic Packaging," report to NSF for Materials Processing and Manufacturing Division Grant 9812686, University of Arizona, Tucson, AZ). Limitations on the range of validity of the elastoplastic and the Perzyna elastoviscoplastic formulations are discussed.

UR - http://www.scopus.com/inward/record.url?scp=22944451810&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=22944451810&partnerID=8YFLogxK

U2 - 10.1115/1.1869514

DO - 10.1115/1.1869514

M3 - Article

VL - 127

SP - 147

EP - 156

JO - Journal of Electronic Packaging, Transactions of the ASME

JF - Journal of Electronic Packaging, Transactions of the ASME

SN - 1043-7398

IS - 2

ER -